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an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. advance information for pre-production products; subject to change without notice. TVS2200 slvsed5 ? december 2017 TVS2200 22-v flat-clamp surge protection device 1 1 features 1 ? ultra-low and flat clamping voltage ? 27.7 v at 40 a (8/20 s) ? r dyn : 30 m ? standoff voltage: 22 v ? survives 10,000 strikes of 35 a 8/20 s surge pulses at 125 c ? robust surge protection: ? iec61000-4-5 (8/20 s): 40 a ? protection against 1 kv, 42 iec 61000-4-5 surge pulses ? iec61643-321 (10/1000 s): 5 a ? low leakage current ? 3.2 na at 27 c ? 22 na at 85 c ? low capacitance: 105 pf ? peak pulse power: ? iec61000-4-5 (8/20 s): 1000 w ? iec61643-321 (10/1000 s): 150 w ? iec 61000-4-2 level 4 esd protection ? 11-kv contact discharge ? 30-kv air gap discharge ? iec 61000-4-4 eft protection ? 80 a (5/50 ns) ? industrial temperature range: ? 40 c to +125 c ? compact package ? 6-pin son package (2 mm 2 mm) 2 applications ? industrial sensor i/o ? medical equipment ? usb type-c v bus ? plc i/o modules ? appliances 3 description the TVS2200 flat-clamp diode is a transient voltage suppressor which provides robust protection for circuits exposed to high transient voltage events. the ic is designed to protect against 40 a of iec61000-4- 5 surge current, robustly protecting systems in harsh industrial environments. unlike traditional tvs diodes, the TVS2200 regulates with a feedback mechanism to ensure precise flat clamping protection below 28 v during a fault. the lower clamping enables a unique protection solution that can significantly lower the voltage a system is exposed during a surge event. this allows designers to confidently select downstream system components with a lower voltage rating, lower system costs and complexity without sacrificing robustness. in addition, the TVS2200 ultra low leakage and low capacitance enable an input protection stage that has less effect on system operation than traditional tvs diodes. typical leakage of 3.2 na at 22 v is smaller than comparable conventional technology, guaranteeing low power dissipation. the device capacitance of 105 pf is also much lower than typical tvs diodes, lowering distortion on sensitive analog input signals and increasing system flexibility. the TVS2200 is available in a small 2 2 son footprint which is ideal for space constrained applications, offering a 70 percent reduction in size compared to industry standard sma and smb packages. the unique precision surge technology allows the TVS2200 to dissipate large surge currents even in a small package, helping system designers save space without sacrificing robustness. device information (1) part number package body size (nom) TVS2200 son (6) 2.00 mm 2.00 mm (1) for all available packages, see the orderable addendum at the end of the data sheet. system diagram connector protected ic TVS2200 in power rall copyright ? 2017, texas instruments incorporated advance information tools & software technical documents ordernow productfolder support &community
2 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 device comparison table ..................................... 3 6 pin configuration and functions ......................... 4 7 specifications ......................................................... 5 7.1 absolute maximum ratings ...................................... 5 7.2 esd ratings ? jedec ............................................ 5 7.3 esd ratings ? iec .................................................. 5 7.4 thermal information .................................................. 5 7.5 electrical characteristics ........................................... 6 8 detailed description .............................................. 7 8.1 overview ................................................................... 7 8.2 functional block diagram ......................................... 7 8.3 feature description ................................................... 7 8.4 device functional modes .......................................... 7 9 application and implementation .......................... 9 9.1 application information .............................................. 9 9.2 typical application ................................................... 9 10 power supply recommendations ..................... 10 11 layout ................................................................... 11 11.1 layout guidelines ................................................. 11 11.2 layout example .................................................... 11 12 device and documentation support ................. 12 12.1 receiving notification of documentation updates 12 12.2 community resources .......................................... 12 12.3 trademarks ........................................................... 12 12.4 electrostatic discharge caution ............................ 12 12.5 glossary ................................................................ 12 13 mechanical, packaging, and orderable information ........................................................... 12 4 revision history date revision notes december 2017 * initial release. advance information
3 TVS2200 www.ti.com slvsed5 ? december 2017 product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 5 device comparison table device v rwm v clamp at i pp i pp (8/20 s) v rwm leakage (na) polarity tvs0500 5 9.2 45 0.3 unidirectional tvs1400 14 18.6 45 2 unidirectional tvs1800 18 22.8 40 0.3 unidirectional TVS2200 22 27.7 40 3.2 unidirectional tvs2700 27 32.5 40 1.7 unidirectional tvs3300 33 38 35 19 unidirectional advance information
4 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 6 pin configuration and functions drv package 6-pin son top view pin functions pin type description name no. in 4, 5, 6 i esd and surge protected channel gnd 1, 2, 3, exposed thermal pad gnd ground advance information in in gnd gnd gnd in gnd 2 3 1 5 4 6
5 TVS2200 www.ti.com slvsed5 ? december 2017 product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated (1) stresses beyond those listed under absolute maximum rating may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating condition . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 specifications 7.1 absolute maximum ratings t a = 27 (unless otherwise noted) (1) min max unit maximum surge iec61000-4-5 current (8/20 s) 40 a iec 61000-4-5 power (8/20 s) 1000 w iec 61643-321 current (10/1000 s) 5 a iec 61643-321 power (10/1000 s) 150 w maximum forward surge iec 61000-4-5 current (8/20 s) 50 a iec 61000-4-5 power (8/20 s) 80 w iec 61643-321 current (10/1000 s) 8 a iec 61643-321 power (10/1000 s) 150 w eft iec 61000-4-4 eft protection 80 a i br dc breakdown current 10 ma i f dc forward current 500 ma t a ambient operating temperature ? 40 125 c t stg storage temperature ? 65 150 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. (2) jedec document jep157 states that 250-v cdm allows safe manufacturing with a standard esd control process. 7.2 esd ratings ? jedec value unit v (esd) electrostatic discharge human body model (hbm), per ansi/esda/jedec js-001, all pins (1) 2000 v charged device model (cdm), per jedec specification jesd22-c101, all pins (2) 500 7.3 esd ratings ? iec value unit v (esd) electrostatic discharge iec 61000-4-2 contact discharge 11 kv iec 61000-4-2 air-gap discharge 30 (1) for more information about traditional and new thermal metrics, see the semiconductor and ic package thermal metrics application report. 7.4 thermal information thermal metric (1) drv (son) unit pins r qja junction-to-ambient thermal resistance 70.4 c/w r qjc(top) junction-to-case (top) thermal resistance 73.7 c/w r qjb junction-to-board thermal resistance 40 c/w y jt junction-to-top characterization parameter 2.2 c/w y jb junction-to-board characterization parameter 40.3 c/w r qjc(bot) junction-to-case (bottom) thermal resistance 11 c/w advance information
6 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 7.5 electrical characteristics over operating free-air temperature range (unless otherwise noted) parameter test conditions min typ max unit v rwm reverse stand-off voltage 22 v i leak leakage current measured at v in = v rwm t a = 27 c 3.2 tbd na i leak leakage current measured at v in = v rwm t a = 85 c 22 tbd na i leak leakage current measured at v in = v rwm t a = 105 c tbd tbd na v f forward voltage i in = 1 ma from gnd to io 0.5 v v br break-down voltage i in = 1 ma from io to gnd tbd 25.9 tbd v v fclamp forward clamp voltage 40 a iec 61000-4-5 surge (8/20 s) from gnd to io, 27 c 1 4 5 v v clamp clamp voltage 24 a iec 61000-4-5 surge (8/20 s) from io to gnd, v in = 0 v before surge, 27 c 27 tbd v v clamp clamp voltage 40 a iec 61000-4-5 surge (8/20 s) from io to gnd, v in = 0 v before surge, 27 c 27.7 tbd v v clamp clamp voltage 35 a iec 61000-4-5 surge (8/20 s) from io to gnd, v in = v rwm before surge, t a = 125 c 27.75 tbd v r dyn 8/20 s surge dynamic resistance calculated from v clamp at 0.5 i pp and i pp surge current levels, 27 c 30 m ? c in input pin capacitance v in = 22 v, f = 1 mhz, 30 mv pp , io to gnd 105 pf sr maximum slew rate 0-v rwm rising edge, measure slew rate when ipk = 1 ma, 27 c 2.5 v/ s sr maximum slew rate 0-v rwm rising edge, measure slew rate when ipk = 1 ma, 105 c 0.7 v/ s advance information
7 TVS2200 www.ti.com slvsed5 ? december 2017 product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 8 detailed description 8.1 overview the TVS2200 is a precision clamp with a low, flat clamping voltage during transient overvoltage events like surge and protecting the system with zero voltage overshoot. 8.2 functional block diagram 8.3 feature description the TVS2200 is a precision clamp that handles 40 a of iec 61000-4-5 8/20 s surge pulse. the flat clamping feature helps keep the clamping voltage very low to keep the downstream circuits from being stressed. the flat clamping feature can also help end-equipment designers save cost by opening up the possibility to use lower- cost lower voltage tolerant downstream ics. the TVS2200 has minimal leakage under the standoff voltage of 22 v, making it an ideal candidate for applications where low leakage and power dissipation is a necessity. iec 61000-4-2 and iec 61000-4-4 ratings make it a robust protection solution for esd and eft events. wide ambient temperature range of ? 40 c to +125 c makes it a good candidate for most applications. compact packages enable it to be used in small devices and save board area. 8.4 device functional modes 8.4.1 protection specifications the TVS2200 is specified according to both the iec 61000-4-5 and iec 61643-321 standards. this enables usage in systems regardless of which standard is required in relevant product standards or best matches measured fault conditions. the iec 61000-4-5 standards requires protection against a pulse with a rise time of 8 s and a half length of 20 s while the iec 61643-321 standard requires protection against a much longer pulse with a rise time of 10 s and a half length of 1000 s. the positive and negative surges are imposed to the TVS2200 by a combinational waveform generator (cwg) with a 2- coupling resistor at different peak voltage levels. for powered on transient tests that need power supply bias, inductances are usually used to decouple the transient stress and protect the power supply. the TVS2200 is post tested by guaranteeing that there is no shift in device breakdown or leakage at v rwm . the TVS2200 also integrates iec 61000-4-2 level 4 esd protection and 80 a of iec 61000-4-4 eft protection. these combine to ensure that the device is able to protect against all transient conditions regardless of length or type. for more information on ti's test methods for surge, esd, and eft testing, reference ti ' s iec 61000-4-x testing application note advance information voltage level detection power fet driver in gnd copyright ? 2017, texas instruments incorporated
8 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated device functional modes (continued) 8.4.2 minimal derating unlike traditional diodes the TVS2200 has very little derating of max power dissipation and ensures robust performance up to 125 c. traditional tvs diodes lose up to 50% of their current carrying capability when at high temperatures, so a surge pulse above 85 c ambient can cause failures that are not seen at room temperature. the TVS2200 prevents this and ensures that you will see the same level of protection regardless of temperature. 8.4.3 transient performance during large transient swings, the TVS2200 will begin clamping the input signal to protect downstream conditions. while this prevents damage during fault conditions, it can cause leakage when the intended input signal has a fast slew rate. in order to keep power dissipation low and remove the chance of signal distortion, it is recommended to keep the slew rate of any input signal on the TVS2200 below 2.5 v/ s at room temperature and below 0.7 v/ s at 125 c. faster slew rates will cause the device to clamp the input signal and draw current through the device for a few microseconds, increasing the rise time of the signal. this will not cause any harm to the system or to the device, however if the fast input voltage swings occur regularly it can cause device overheating. advance information
9 TVS2200 www.ti.com slvsed5 ? december 2017 product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 9 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 9.1 application information the TVS2200 can be used to protect any power, analog, or digital signal from transient fault conditions caused by the environment or other electrical components. 9.2 typical application figure 1. TVS2200 application schematic 9.2.1 design requirements a typical operation for the TVS2200 would be protecting a usb type-c v bus input, with a nominal input voltage of 20 v and a required withstand of 22 v, as shown in figure 1 . in this example, a TVS2200 is protecting the input to a tps65982 type-c port controller. without any input protection, if a surge event is caused by lightning, coupling, hot-swap ringing, or any other fault condition this input voltage will rise to hundreds of volts for multiple microseconds, violating the absolute maximum input voltage and harming the device. 9.2.2 detailed design procedure if the TVS2200 is in place to protect the device, during a surge event the voltage will rise to the breakdown of the diode at 25.9 v, and then the TVS2200 will turn on, shunting the surge current to ground. with the low dynamic resistance of the TVS2200, even large amounts of surge current will have minimal impact on the clamping voltage. the dynamic resistance of the TVS2200 is around 30 m , which means 30 a of surge current will cause a voltage raise of 30 a 30 m ? = 0.9 v. because the device turns on at 25.9 v, this means the input will be exposed to a maximum of 25.9 v + 0.9 v = 26.8 v during surge pulses, robustly protecting the usb type-c port. finally, the small size of the device also improves fault protection by lowering the effect of fault current coupling onto neighboring traces. the small form factor of the TVS2200 allows the device to be placed extremely close to the input connector, lowering the length of the path fault current will take through the system compared to larger protection solutions. advance information
10 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated typical application (continued) 9.2.3 application curves tbd 9.2.4 configuration options the TVS2200 can be used in either unidirectional or bidirectional configuration. the TVS2200 shows unidirectional usage to protect an input. by placing two TVS2200's in series with reverse orientation, bidirectional operation can be utilized which will allow a working voltage of 22 v. TVS2200 operation in bidirectional will be similar to unidirectional operation, with a minor increase in breakdown voltage and clamping voltage. 10 power supply recommendations the TVS2200 is a clamping device so there is no need to power it. take care not to violate the recommended v in voltage range (0 v to 22 v) to ensure the device functions properly. advance information
11 TVS2200 www.ti.com slvsed5 ? december 2017 product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 11 layout 11.1 layout guidelines the optimum placement is as close to the connector as possible. emi during an esd event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures. the pcb designer needs to minimize the possibility of emi coupling by keeping any unprotected traces away from the protected traces which are between the tvs and the connector. route the protected traces as straight as possible. eliminate any sharp corners on the protected traces between the TVS2200 and the connector by using rounded corners with the largest radii possible. electric fields tend to build up on corners, increasing emi coupling. 11.2 layout example figure 2. TVS2200 layout advance information
12 TVS2200 slvsed5 ? december 2017 www.ti.com product folder links: TVS2200 submit documentation feedback copyright ? 2017, texas instruments incorporated 12 device and documentation support 12.1 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 12.2 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 12.3 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 12.4 electrostatic discharge caution this integrated circuit can be damaged by esd. texas instruments recommends that all integrated circuits be handled with appropriate precautions. failure to observe proper handling and installation procedures can cause damage. esd damage can range from subtle performance degradation to complete device failure. precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 12.5 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions. 13 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation. advance information
package option addendum www.ti.com 21-dec-2017 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples pTVS2200drvr active wson drv 6 3000 tbd call ti call ti -40 to 125 TVS2200drvr preview wson drv 6 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year -40 to 125 1hvh (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis.
generic package view images above are just a representation of the package family, actual package may vary. refer to the product data sheet for package details. drv 6 wson - 0.8 mm max height plastic small outline - no lead 4206925/f
www.ti.com package outline c 6x 0.35 0.25 1.60.1 6x 0.3 0.2 2x 1.3 10.1 4x 0.65 0.8 max 0.05 0.00 b 2.1 1.9 a 2.1 1.9 (0.2) typ wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/a 12/2015 pin 1 index area seating plane 0.08 c 1 3 4 6 (optional) pin 1 id 0.1 c a b 0.05 c thermal pad exposed 7 notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. the package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. scale 5.500
www.ti.com example board layout 0.07 min all around 0.07 max all around (1) 4x (0.65) (1.95) 6x (0.3) 6x (0.45) (1.6) (r ) typ 0.05 ( ) via typ 0.2 (1.1) wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/a 12/2015 symm 1 3 4 6 symm land pattern example scale:25x 7 notes: (continued) 4. this package is designed to be soldered to a thermal pad on the board. for more information, see texas instruments literature number slua271 (www.ti.com/lit/slua271). 5. vias are optional depending on application, refer to device data sheet. if some or all are implemented, recommended via locations are shown. solder mask opening solder mask metal under solder mask defined metal solder mask opening solder mask details non solder mask defined (preferred)
www.ti.com example stencil design 6x (0.3) 6x (0.45) 4x (0.65) (0.7) (1) (1.95) (r ) typ 0.05 (0.45) wson - 0.8 mm max height drv0006a plastic small outline - no lead 4222173/a 12/2015 notes: (continued) 6. laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. ipc-7525 may have alternate design recommendations. solder paste example based on 0.125 mm thick stencil exposed pad #7 88% printed solder coverage by area under package scale:30x symm 1 3 4 6 symm metal 7
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